COUNTERFEIT SCREENING AND DETECTION

Substandard electronic components have made there way into some of today’s most advanced weapons

Counterfeit IC devices are being found in helicopters, weapons, submarines, planes, and many other military applications. When these devices fail under a mission critical time. It could be the difference between life and death for our military personnel.

By having your parts tested and inspected by third party test laboratory, you are doing your due diligence. Before the sale of any components or IC devices, it is important to have them tested to ensure a devices authenticity.

visual

External Visual Inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.  Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

decap

Chemical Etch or Decap. Decapsulation is to chemically etch a device until the die is exposed. This is done with a Jet Etch system from Nisene Technology Group. Once exposed a device may be confirmed by reading the internal die markings under a microscope. In some events a die marking will correlate with a devices external markings.
heated
Heated Chemical Test or HCT is performed on an electronic component or IC device to check for a secondary coating. This process is performed by heating a specific chemical to a certain temperature. Once temperature is reached, a plastic IC device is submerged half way into the chemical. When left over a specific period of time the partially cured resins, paint, blacktop, or secondary coating will be dissolved. After this process is complete a clear picture is taken under a microscope to show a secondary coating if the device had one.

xrf

XRF can be carried out on parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. This is a non-destructive test. A complete graph will be providing with a list of substances found.

X-ray

X-Ray Analysis inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. Our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size.

electrical-testing

Full AC/DC Electrical Testing. An array of electrical bench equipment (DC power supplies, Digital Multimeters, LCR and Source Meters) can be integrated to perform an assortment of component level tests. Additionally, the use of both low and high power curve tracers (Tektronix 576, CA4810A or Sentry machine, respectively) can be used to evaluate input and output characteristics of components. The pin to pin curve characteristics can also be used to compare known “good” devices with unknown devices to provide some minimal level of examination on the components. Also the pin to pin curve trace is helpful during failure analysis.