Aero Supply USA understands that counterfeit electronics parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or surplus parts or salvaged scrap parts. The packaging of these parts is altered to modify their identity or to disguise the effects of salvaging. The modification can be as simple as the removal of old marking and then adding new marking, or as complicated as recover of a die and repackaging. Our counterfeit mitigation processes are conducted by Global Electronics Testing Services, LLC.

Global Electronics Testing Services, LLC is a top independent test lab specializes in component testing and authentication. Our all-star team is made up of top professionals whose experience in the electronic industry is unsurpassed; many have worked directly for large component manufacturers as well as large component distributors. We are strategically located throughout the world with locations in the USA, UK and our Global Electronics Testing Services China LLC is located in the heart of the Shenzhen components market. Customers can simply drop ship all products to our facility and our dedicated team will ensure your products are up to standard or purchase agreement. As an unbiased independent test lab we are here to protect our customer’s best interest and save cost. We will eliminate your risk and help your company grow by providing a complete solution from our detail accuracy authentication process, electrical testing, packaging, warehousing and global logistics.

External Visual Inspection – External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

Mark Permanency – Incoming inspection is the process of verifying the conditions of materials used for shipping. At Global Electronics Testing Services we will check for box damaged, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, correct MSL packaging, documents match and country origin match components.

Surface Chemical Test – This test process will be able to confirm and determine if the device has been remarked or resurfacing. As a part of counterfeiting many suppliers used an older date code or slow speed devices, refurbished them to appear new and marked as higher grade or with a recent date code or as RoHS compliant. Counterfeiters have access to reclaimed, scrapped and excess parts, which are easily available from unauthorized sources. These tests consider a destructive test. Re-Surfacing / Re-Marking test are based on AS5553, MIL-STD-202 and JESD22-B107C.

Internal Visual Inspection (Decapsulation) – Decapsulation inspection is a process of verifying the manufacturer die to ensure that it is the correct one. This considers being a destructive test. We have many different methods to expose the die. Once the die exposed the attributes of the die, such as die markings, metallization damage due to ESD or corrosion will be verify. Decapsulation is performing on 1 sample per lot code or date code base on MIL-STD-883, Method 2014.

X-Ray Fluorescence Spectroscopy (XRF) – XRF can be carried out on the parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. It is a non-destructive test. A complete graph will be providing with a list of substances found. The EU RoHS Directive (2011/65/EU) restricts the maximum allowable levels of lead (Pb), cadmium (Cd), mercury (Hg), hexavalent chromium (Cr6+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants to 0.1% or 1000ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material in electrical equipment and electronic products. In order to manufacturer these products within or imports into the European Union, manufacturers are responsible for providing due diligence documentation.

X-Ray Inspection – X-ray inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. At Global Electronics Testing Services our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size. X-Ray perform base on AS5553 and MIL-STD-883 2012.7.

Solderability Test – Solderability is a test to determine if the components will have soldering issue at the contract manufacturer. Especially with old date code components leads can have oxidation. This will caused components not be able to solder to the board. As the result you will have mechanical failure which will delay the CM process and increase cost. It is recommended that all lead devices that are more than two years old shall subject to Solderability test.

AC/DC Electrical Test – Global Electronics Testing Services offers wide range of components testing from basic DC limited function to full DC/AC function test at temperature including up-screening of all type of devices. As a solution provider our engineering team is ready help.

  • Devices family included:
  • Digital, Linear, Memory, and MPU
  • Linear IC, Op Amps, and Mixed Logic
  • Microprocessors, DSPs, Microcomputers
  • Memories, RAM, FPGA, ROM
  • Discrete Semiconductors, Transistor, Diode, Zener, SCR or Triac
  • Passives capacitors, Resistor, Inductor, Magnetic, Crystal, Filters

Up-Screening – At Global Electronics Testing Services, we have the ability to take commercial (C grade) products and test them at a higher temperature to obtain “I” and “M” grade components. Global Electronics Testing Services provides comprehensive electrical and environmental testing of all types of semiconductors. These includes but are not limited to:

  • FPGAs
  • Microcontrollers
  • Microprocessors
  • Memories

Baking and Dry-Pack – Many devices are moisture sensitive with improper packaging this can cause major issue at the end user. Moisture induced interface delamination begins with the package absorbing moisture form the environment, which condenses in micropores in polymer materials such as the substrate, die attach and molding compound. During PCB assembly process, when the part is exposed to high temperatures associated with the soldering process, popcorning may occur. We can eliminate these problems by baking and dry-pack of all moisture sensitive devices prior to leaving our facility. All process is based on J-STD-033B-1.

Global Logistic – Shipping globally can be a nightmare if you don’t know the rules and regulations. You can end up paying high taxes, delay shipments as well as have your shipment confiscated because of improper documentation. Global Electronics Testing Service China can provide a range of logistics services and expertise that can save you money, time and ensure proper documentation, so your shipment doesn’t get stuck or confiscated in custom. We have a network of logistics professionals spanning the globe ready to help with any shipment you may have. A global distribution network is necessary to excel in the global marketplace and Global Electronics Testing Service China can give that edge without the expense.